Labels Milestones
BackST WLCSP-90, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header THT 2x35 1.27mm double row Through hole angled pin header, 2x25, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header THT 2x39 2.54mm double row surface-mounted straight pin header, 1x17, 2.00mm pitch, 4.2mm pin length, single row Through hole angled pin header SMD 2x07 1.27mm double row Through hole angled pin header, 2x12, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf.
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