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BackVery small outline package; 16 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/drv8801.pdf#page=31 MO-220 variation VJJD-2), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM10B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-141 , 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py.
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- 4.7897 6.94018 facet normal 0.801144 -0.59432 -0.0703636.
- -0.790944 -6.85859 7.37319 facet normal 4.720716e-001 -8.093081e-001 3.495267e-001.
- Normal 0.555731 0.831362 -3.10615e-07.
- -0.0906197 0.920082 0.381101 facet normal.