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30x30mm WE-SHC Shielding Cabinet Two Piece SMD 36.83x33.68mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies BMI-S-206-F Shielding Cabinet One Piece SMD 26.21x26.21mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies BMI-S-210-F Shielding Cabinet One Piece SMD 16.50x16.50mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies BMI-S-205-F Shielding Cabinet THT 61x61mm Signal Relay, 10x6mm, 2 Form C, Gull Wings, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Data+Sheet%7F108-98001%7FZ.1%7Fpdf%7FEnglish%7FENG_DS_108-98001_Z.1.pdf TE IM-Series Relay J JLeg AXICOM HF3-Series Relay Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm SSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B9B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105309-xx03, 3 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN6 3*3 MM, 0.95 PITCH; http://www.ti.com/lit/ds/symlink/lmr62421.pdf 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat No Lead Package (MF) - 6x5 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin, dual row male, vertical entry Harwin Female Vertical Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 8.61mm 338mil SMD LowProfile JPin SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST , Piano, row spacing.

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