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2.605x2.703mm package, pitch 0.65mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.5mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 10x10mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole vertical IDC box header THT 1x08 2.54mm single row Through hole straight socket strip, 2x40, 2.00mm pitch, double rows Through hole socket strip SMD 1x34 2.54mm single row style2 pin1 right Through hole angled pin header, 1x18, 2.00mm pitch, double rows Surface mounted pin header SMD 1x16 2.54mm single row (from Kicad 4.0.7!), script generated Surface mounted pin header SMD 1x30 2.00mm single row Through hole angled pin header, 1x39, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x32, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x17, 5.08mm pitch, single row Through hole angled pin header THT 2x26 2.00mm double row surface-mounted straight socket strip, 2x03, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole horizontal IDC header THT 2x06 2.54mm double row surface-mounted straight socket strip, 2x26, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x15 1.27mm double row Through hole pin header SMD 1x26 2.54mm single row Through hole straight socket strip, 2x21, 1.27mm pitch, double rows Surface mounted pin header SMD 1x15 2.00mm single row style1.

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