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For rev 2 beta by adding +5V, and both trigger/gate and CV lines? **UI:** - 3 x 10.1 mm, Time-Lag T, 250 VAC, 125 VDC (https://us.schurter.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_UMT_250.pdf Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7811245, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate side entry Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-06A2, example for new mpn: 39-28-x12x, 6 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 43915-xx06, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-14A2, example for new mpn: 39-30-0040, 2 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator XP_POWER IHxxxxD DIP DCDC-Converter XP_POWER IAxxxxS, SIP, (https://www.xppower.com/pdfs/SF_IA.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP.

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