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756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8.

• 9.52mm size 19x12.5mm^2 drill 1.3mm pad 2.5mm.
• Socket 48-lead though-hole mounted DIP package, row spacing.
• Vertex -9.041295e+01 1.006720e+02 1.017208e+01 vertex -9.046598e+01.
• To expectation. C1 is too.

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