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ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm.

• 4.750866e-003 1.105365e-001 vertex -5.001358e+000.
• Yoshiki Shibukawa Copyright (c) 2019 All.
• 4.948441e+000 2.491820e+001 facet normal -0.0813397 -0.0812122 0.993372 vertex.
• -7.01491 -0.282485 6.94563 vertex.

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