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1
Back

0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/6957fb.pdf#page=36), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 40 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RI_20_1.pdf), generated with kicad-footprint-generator Hirose series connector, B13B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5050, 5 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0408-9-51.

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