3
1
Back

Grid, 10x10mm package, pitch 0.5mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole socket strip SMD 1x23 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x34 2.54mm double row Through hole pin header THT 1x08 2.54mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x31 1.27mm double row Through hole angled socket strip SMD 2x17 2.54mm double row Through hole socket strip SMD 1x17 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x06 1.27mm double row Through hole angled socket strip THT 2x15 2.54mm double row Through hole angled pin header, 2x23, 1.27mm pitch.

New Pull Request