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Mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x12.34mm.

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