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BackFiles *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Latest commits for branch traces_before_hard_sync traces added but maybe won't keep a704d3e530 More traces and vias, and net links.
- LFCSP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083.
- 50mm SilkScreenTop Type 1 Gauge, Massstab, 10mm, CopperTop.