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With SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x31, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x35 2.54mm single row Through hole straight socket strip, 1x38, 2.54mm pitch, double rows Through hole Samtec HPM power header series 11.94mm post length THT 1x04 2.54mm single row Surface mounted pin header SMD 1x12 2.00mm single row style1 pin1 left Surface mounted socket strip THT 1x28 2.00mm single row Through hole Samtec HPM power header series 11.94mm post length THT 1x04 2.54mm single row Surface mounted pin header SMD 1x22 2.54mm single row Through hole pin header THT 1x03 1.00mm single row Through hole pin header THT 2x32 1.27mm double row Through hole angled pin header, 2x07, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x38 1.27mm double row Through hole straight socket strip, 1x22, 2.00mm pitch, double rows Through hole angled pin header THT 2x01 2.54mm.

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