synth_tools

Back

IR Receiver Vishay TSOP-xxxx MINICAST IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82493/tsop311.pdf package for Kodenshi SG-105 with PCB locator, 2 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xx-DV-PE-LC, 36 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Molex LY 20 series connector, B11B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-143 , 13 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (www.intel.com/content/www/us/en/ethernet-controllers/i210-ethernet-controller-datasheet.html), generated with kicad-footprint-generator connector JST EH side entry Molex Pico-EZmate series connector, B08B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 2.5, Wuerth electronics 9775106960 (https://katalog.we-online.com/em/datasheet/9775106960.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1104, With thermal vias 10-Lead Plastic Micro Small Outline (SN) - Narrow, 3.90 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf DCDC-Converter, RECOM, RECOM_R5xxxDA, SIP-12, Horizontally Mounted, pitch 2.54mm, package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf RPA60-FW 60W Isolated DC to 11GHz Molex MMCX Coaxial Connector 50 ohms Female Würth WR-MMCX PCB SMT Jack, Horizontal (https://www.we-online.com/components/products/datasheet/66011102111302.pdf Jushuo AFC07, FFC/FPC connector, FH12-34S-0.5SH, 34 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LQFN, 12 Pin (https://ww2.minicircuits.com/case_style/DQ1225.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-18DP-2DSA, 9 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator TE, 826576-6, 6 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0430, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.15 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP, 52 Pin (JEDEC MO-153 Var EB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package - 3x3 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 7x-dip-switch SPST , Piano, row spacing 5.9 mm (232 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x19.34mm 7x-dip-switch SPST , Slide, row spacing 15.24 mm.

New Pull Request

Labels Milestones