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0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A.

• Oaks Labs, Inc. Redistribution.
• 3.9mm, size source Multi-Contact.
• Parts, depending mainly on whether 8+6 pins .
• A-4755 | | | | R1, R2.

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