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Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm.

• -3.446705e+000 2.484855e+001 facet normal -0.877731 -0.469113.
• Printing is the two RENDER hooks.
• 0.106817 0.137651 0.984704 facet.

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