3
1
Back

53048-0510, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0710, with PCB locator, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator XP_POWER IHxxxxDH DIP DCDC-Converter XP_POWER IHxxxxDH, DIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, B20B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 3.5, Wuerth electronics barrel jack connector 6P6C Shielded RJ45 ethernet plug 10/100/1000 Base-T RJ45 single port with LEDs https://media.digikey.com/pdf/Data%20Sheets/Pulse%20PDFs/JK%20Series.pdf#page=2 RJ45 ethernet transformer with magnetics (https://productfinder.pulseeng.com/doc_type/WEB301/doc_num/JXD6-0001NL/doc_part/JXD6-0001NL.pdf ethernet 8p8c transformer poe rj45 8 Pol Shallow Latch Connector, Modjack, RJ45 (https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/c-bmj-0102.pdf Shielded, 2 LEDs, https://www.haloelectronics.com/pdf/fastjack-100baset.pdf 10/100 Ethernet RJ45 Tab-Down Halo FastJack, Shielded, 2 LED, 2 Ports, http://www.amphenolinfocom.eu/NavData/Drawings/RJHSE-538X-02-REVC.pdf RJ45 8p8c ethernet POE 10/100/1000 Base-T Transformer Module, PT61020EL (https://www.bourns.com/pdfs/PT61020.pdf Gigabit PoE Ethernet Transformer Single SMD RF transformer, 50 ohm, 4.5 to 3000Mhz, https://www.minicircuits.com/pdfs/TC1-1-13M+.pdf WE-AGDT Auxiliary Gate Drive Transformer, 1:1, 9.5x7.1x5.3mm.

New Pull Request