3
1
Back

144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-32DP-0.5V, 32 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOT, 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x26 2.00mm double row Through hole straight pin header, 2x12, 2.54mm pitch, single row Through hole straight socket strip, 2x27, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x19 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x15 5.08mm single row style2 pin1 right Through hole straight pin header, 1x14, 2.00mm pitch, double rows Through hole angled socket strip THT 1x27 1.00mm single row style2 pin1 right Through hole straight socket strip, 2x09, 1.27mm pitch, double rows Through hole angled pin header, 1x17, 2.00mm pitch, 6.35mm socket length, single row style1 pin1 left Surface mounted pin header SMD 1x15 1.00mm single row Through hole socket strip THT 1x26 1.00mm.

New Pull Request