Labels Milestones
Back480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SO, 8 Pin (http://ww1.microchip.com/downloads/en/devicedoc/20005514a.pdf#page=35), generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP 11.0x15.9mm Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm SSOP-8 2.95x2.8mm Pitch 0.65mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (JEDEC MO-153 Var BD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose.
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