Labels Milestones
BackBackups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes unplated through holes: ============================================================= 77735c00cc3285131373f5cfc61b82eab5963d12 Update README.md 3d0ca7fdf6e2ad8d7864221e585c668e46544055 Update README.md * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf ## Git repository From 40ce306867b3d353457e134a232ee65f5767bece Mon Sep 17 00:00:00 2001 Subject: [PATCH 04/18] adds front.
- 0.555899 4.94372e-08 vertex -2.43216 -2.40639 6.59.
- Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin.
- Connecting a trace already use.