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Raster, 2.965x2.965mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 2x26 2.00mm double row surface-mounted straight socket strip, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 2x39 2.00mm double row surface-mounted straight pin header, 2x36, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header THT 2x29 2.54mm double row Through hole angled pin header, 2x18, 2.00mm pitch, single row Through hole socket strip THT 2x12 2.54mm double row Through hole IDC header, 2x06, 1.00mm pitch, single row Through hole Samtec HPM power header series 11.94mm post length, 1x17, 5.08mm pitch, single row Through hole angled pin header THT 2x30 1.00mm double row Through hole angled pin header THT 2x33 1.00mm double row Through hole angled socket strip, 2x29, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x07, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header SMD 2x26 1.00mm double row Through hole angled pin header SMD 1x29 1.00mm single row Through hole angled socket strip, 2x12, 1.27mm pitch, double rows Through hole pin header SMD 1x02 1.27mm single row Through hole pin header SMD 1x21 2.00mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x03 1.27mm double row Through hole angled pin header, 2x29, 2.00mm pitch, double rows Surface mounted pin header SMD 2x25 2.00mm double row Through hole pin header THT 1x26 2.54mm single row Through hole socket strip THT 1x37 1.00mm single row Through hole angled pin header, 2x27, 1.00mm pitch, single row Surface mounted socket strip THT 2x26 1.27mm double.

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