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20mm width 6.4mm height 6.4mm Resistor, Axial_Power series, Box, pin pitch=60.96mm, 15W, length*width*height=48*12.5*12.5mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf Resistor Axial_Power series Box pin pitch 10.00mm length 13.5mm width 4mm Capacitor C, Rect series, Radial, pin pitch=7.50mm, , diameter=12.5mm, Electrolytic Capacitor CP, Radial series, Radial, pin pitch=15.00mm, , length*width=18*5mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf C Rect series Radial pin pitch 10.00mm length 11.0mm width 6.3mm Capacitor C, Rect series, Radial, pin pitch=7.50mm 10.00mm, , length*width=13*6.5mm^2, Capacitor C Radial series Radial pin pitch 10.00mm diameter 24mm Inductor, Radial series, Radial, pin pitch=15.00mm, , length*width=18*5mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf C Rect series Radial pin pitch 5.08mm size 10.2x11.2mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-612 45Degree pitch 7.5mm size 17.3x14mm^2 drill 1.15mm pad 3mm Terminal Block 4Ucon ItemNo. 10686, 9 pins, pitch 10mm, size 45x9mm^2, drill diamater 1.3mm, pad diameter 2.7mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R5xxxDA, SIP-12, Horizontally Mounted, pitch 2.54mm, size 20.78x6.5mm^2, drill diamater 1.1mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00067_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block WAGO 236-448, 45Degree (cable under 45degree), 5 pins, pitch 5mm, size 20x8mm^2, drill diamater 1.15mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator TE, 3-826576-6, 36 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0010 example for new part number: 22-27-2081, 8 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: AE-6410-04A example for new part number: 5273-07A example for new mpn: 39-30-0100, 5 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Molex LSHM.

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