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Documentation: https://kicad.org/help/file-formats/ # Netlist files (exported from Pcbnew) Initial version \#* New KiCad version; non Al panel Gerbers # Exported BOM files Upload files to '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MIRROR IMAGE.png' Panel Style Guide From 4c5e03f875a81278be4b8089dd10dd98b0c86e5d Mon Sep 17 00:00:00 2001 Subject: [PATCH] More work finding space for everything, lining things up more Binary files /dev/null and b/Panels/FireballSpell_Large.webp differ Binary files a/3D Printing/Panels/image.png and /dev/null differ attr (teardrop (type padvia min_thickness 0.0254) (filled_areas_thickness no From 32ded0979b3a28a6950eb6a371cc2ef88606b4ff Mon Sep 17 00:00:00 2001 Latest commits for file Schematics/Dual_VCA_with_cv2_OTA.diy Start of LM13700 version to see why 77735c00cc3285131373f5cfc61b82eab5963d12 5ff3077e8252367b7eceb0b21b0803904b695d42 Fix sr2 blue caixa_sr2.png | Bin 0 -> 121262 bytes Panels/FireballSpell_Large_bw.png | Bin 0 -> 37432 bytes Panels/futura medium condensed bt.ttf' ## Current draw 12 mA +12 V, and sustain voltage is taken from \npot pin 1 x 1 mm, 734-166 , 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1106, With thermal vias in pads, 4 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py Quectel BG96 Cellular GSM 2G Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4 Quectel BG96 Cellular GSM 2G Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4 Quectel BG96 Cellular GSM 2G Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4 Quectel BG96 Cellular GSM 2G Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4 Quectel BG96 Cellular GSM 2G Module L-band satellite communication module, https://docs.astrocast.com/dl/0532-DOC-M2M-ASTRO-Astronode_S-Datasheet.pdf RF module Astrocast radio Astronode 2.4 GHz Wi-Fi and Bluetooth module Single 2.4 GHz Wi-Fi and Bluetooth module Single 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth combo chip Single 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-33S-0.5SH, 33 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Quad Flat, No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf Fairchild Power33 MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm.

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