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1
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3x3x0.5 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5060, 6 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Molex Picoflex side entry Harwin LTek Connector, 44 pins, single row style1 pin1 left Surface mounted pin header SMD 2x04 2.00mm double row surface-mounted straight socket strip, 2x08, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length THT 1x14 5.08mm single row Through hole angled pin header THT 1x37 2.00mm single row Through hole angled socket strip, 2x11, 2.00mm pitch, double rows Through hole angled socket strip THT 1x24 2.00mm single row style2 pin1 right Through hole angled pin header, 1x25, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x20 1.00mm double row surface-mounted straight pin header, 2x11, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x39 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x12 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x03 1.27mm single.

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