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Diameter=69.1mm, Vishay, TJ9, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Horizontal series Radial pin pitch 10.00mm diameter 24mm Inductor, Radial series, Radial, pin pitch=37.50mm, , length*width=41.5*13mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 10.00mm length 13mm width 6.5mm Capacitor C, Rect series, Radial, pin pitch=6.60mm, , length*width=16.4*7.6mm^2, Vishay, TJ3, BigPads, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Vertical series Radial pin pitch 45mm length 42mm diameter 35.0mm Electrolytic Capacitor CP, Radial series, Radial, pin pitch=20.80mm, , length*width=48.8*25.4mm^2, Vishay, TJ8, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Vertical series Radial pin pitch 5.00mm diameter 10.5mm C, Disc series, Radial, pin pitch=5.00mm, , diameter*width=11*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf C Disc series Radial pin pitch 10.00mm diameter 24mm Inductor, Radial series, Radial, pin pitch=10.00mm, , length*width=11.0*5.3mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 2.54mm size 20.8x6.2mm^2 drill 1.1mm pad 2.2mm Terminal Block WAGO 804-308, 45Degree (cable under 45degree), 9 pins, pitch 3.81mm, size 11.3x7.3mm^2, drill diamater 1.3mm, pad diameter 2.7mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-126-02-xx-DV-PE-LC, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S13B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-146-02-xxx-DV-LC, 46 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD.

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