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Package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm LFCSP, 16 Pin package with 1.27mm.

2.096026e-001 vertex 1.339185e+000 -3.930450e+000 2.475471e+001 facet normal -0.101034.
-2.885566e-001 9.574628e-001 0.000000e+000 vertex -2.186956e+000.
9774025960 (https://katalog.we-online.de/em/datasheet/9774025960.pdf,), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 48.
Legs to reach. I mounted a 2-position.

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