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Teardrops and gnd fill Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation 6523065365 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Shrink Small Outline No-Lead 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78Bxx-2.0.pdf dc-dc recom buck sip-4 pitch 2.54mm size 18.240000000000002x6.5mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00046, 3 pins, pitch 2.54mm, size 8.08x6.5mm^2, drill diamater 1.3mm, pad diameter 2.2mm, see http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-204 45Degree pitch 5mm size 50x9mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-403, 45Degree (cable under 45degree), 8 pins, pitch 5mm, size 25x12.5mm^2, drill diamater 0.7mm, pad diameter 2.5mm, hole diameter 0.7mm THT pad rectangle square THT rectangular pad as test Point, diameter.

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