3
1
Back

Pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header THT 1x22 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x40, 2.54mm pitch, single row style1 pin1 left.

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