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Kicad-footprint-generator 2220 Tricolor PLCC-4 LED, https://docs.broadcom.com/docs/ASMB-KTF0-0A306-DS100 LED Avago PLCC-4 ASMB-MTB0-0A3A2 LED Avago PLCC-6 ASMT-YTB7-0AA02 High Power CSP LED, 2.36mm x 2.36mm, 1.4A max, https://cdn.samsung.com/led/file/resource/2021/01/Data_Sheet_LH181B_Rev.4.0.pdf 2.0mm x 2.0mm Addressable RGB LED, through hole, DF11-22DP-2DSA, 11 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.127 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 1.7mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-149-02-xxx-DV-BE-A, 49 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1200 (alternative finishes: 43045-082x), 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (JEDEC MO-241/VAC, https://assets.nexperia.com/documents/package-information/SOT764-1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE-A, 23 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B12B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST ZE series connector, B4P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.5x2.5mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13), generated with kicad-footprint-generator Soldered wire connection, for a single 0.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90325-0006, 6 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated.

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