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Back*~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill.
- 4.371906e-001 8.639750e-001 vertex -3.464629e+000 -2.815020e+000 2.491820e+001 facet normal.
- 0.65 thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin.