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Of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300.

• -7.11876 -4.7566 5.56266 facet normal 0.891007 0.45399.
• HVSON, 8 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator.
• 4.727985e-003 1.178182e-001 facet normal 5.212690e-001 8.533924e-001 0.000000e+000 facet.
• -0.116097 -3.58571e-05 0.993238 facet normal 3.766283e-14 -1.000000e+00.
• 2.0x1.2x0.9mm, https://eu.mouser.com/datasheet/2/87/eaton-mcl2012v1-multilayer-chip-inductor-data-shee-1622891.pdf Inductor ferrite multilayer power.

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