synth_tools

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122.66 (end 170 133.1525 (end 185 132.25 (end 185 132.25 (end 185 132.25 (end 185 132.25 (end 185 132.25 (end 185 130.75 (end 172.66 121.975 (end 170.12 121.975 (end 171.953606 129.605 (end 170.373606 128.025 (end 171.39 122.6375 (end 173.7525 125 (end 164.22 117.1225 (end 164.22 117.97 (hatch edge 0.5 "name": "Grouped By Value", (offset 0.762) hide (end -3.81 -2.54 (end -2.54 -5.08 (offset 1.016) hide (end 1.016 2.54 (end -1.016 -2.54 (offset 0) hide From d48d677c9103ec90137a6830434841a576342e9a Mon Sep 17 00:00:00 2001 Subject: [PATCH 01/18] Added hard sync to schematic, laid out PCB with on-board Fireball/Fireball.kicad_pcb | 7889 Fireball/Fireball.kicad_sch | 6 Synth Mages Power Word Stun.kicad_prl | 6 Fireball/Fireball.kicad_sch | 120 Fireball/fp-info-cache | 86150 master ttrss-plugin- _comics/init.php 366 lines From 4ee68877235c53d350cd6d734e74936e7f605c70 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add some perfboard sections, power headers, teardrops Add some perfboard sections, power headers, teardrops 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/PRISMATIC SPHERE.png and /dev/null differ From 2dd0b8c0c736720a0b064bbe1304dc9562beb260 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/UNSEEN SERVANT.png differ Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack - Confirm barrel power jack 2mm 2.5mm KLDX-0202-BC KLDX-0202-AC 1.10mm Pitch microSD Memory Card Connector, Reverse Type, Outer Tail, Spring Eject Type (https://global.kyocera.com/prdct/electro/product/pdf/5638.pdf SD Card Connector, Surface Mount, ZIF, 15 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf molex FFC/FPC connector Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 pin, 4x4mm, 2.1mm sq pad (http://www.analog.com/media/en/technical-documentation/data-sheets/ADG633.pdf LFCSP, 16.

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