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Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-794067-x, 7 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 28 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with kicad-footprint-generator JST SUR series connector, S12B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator JST SUR series connector, 502382-0670 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator JST XA series connector, 501331-0607 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator JST VH series connector, 501331-0207 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xxx-DV, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 68 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 44 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 505AB (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MO-194 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py 64-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/19965.pdf, script-generated.

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