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Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 5.9 mm (232 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 6.73 mm (264 mils), body size 6.7x9.18mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of 8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils SMD DIP Switch SPST Slide 5.25mm 206mil JPin SMD 6x-dip-switch SPST , Piano, row.

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