3
1
Back

TO-50-3 Macro T Package Style M234 Rohm HRP7 SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole straight pin header, 2x36, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole socket strip SMD 2x20 2.00mm double row surface-mounted straight socket strip, 1x04, 2.00mm pitch, double rows Surface mounted pin header SMD 1x38 1.00mm single row style2 pin1 right Through hole angled socket strip SMD 1x07 1.00mm single row (from Kicad 4.0.7.

New Pull Request