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Ipc_gullwing_generator.py DSO DSO-8 SOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Horizontal.

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