Labels Milestones
BackWLCSP-132, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 1x08 2.00mm single row Through hole straight socket strip, 1x21, 1.27mm pitch, single row style2 pin1 right Through hole vertical IDC box header, 2x20, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x16 2.00mm double row Through hole angled pin header, 2x35, 1.00mm pitch, 2.0mm pin length, double rows Surface.
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