3
1
Back

16-pin module, column spacing 22.86 mm (900 mils), Socket 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads.

New Pull Request