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Back0.865139 0.246453 facet normal 9.062994e-001 2.999732e-003 4.226256e-001 vertex 5.052543e+000 2.033953e+000 2.475471e+001 facet normal -2.880153e-004 -5.040268e-004 -9.999998e-001 ## Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf ## Git repository * [https://github.com/holmesrichards/precadsr](https://github.com/holmesrichards/precadsr ## Submodules This repo uses submodules aoKicad and Kosmo_panel, which provide needed libaries for KiCad. To clone: submodules avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals - make power connection traces larger; MK uses .6mm -- this is good practice, but ho-dang what a mess romps with traces, vias, and net links 06eccf7d9c added the once through idea with commentary by Correcting changed filename in .prl Correcting changed filename in .prl gets jiggy with PCB locator, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Hirose DF11 through hole, DF11-4DP-2DSA, 2 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B3P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.1 mm² wires, basic insulation.
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