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BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole straight socket strip, 2x12, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip, 1x22, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7!), script generated Through hole straight pin header, 2x25, 1.00mm pitch, single row Through hole angled socket strip SMD 1x17 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x37 2.00mm single row Through hole angled socket strip, 2x29, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole horizontal IDC header THT 1x23 2.54mm.

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