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SFECV, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 6.9x2.9mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, hand-soldering, 14.0x8.7mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 14.0x8.7mm^2 package SMD Crystal Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL ZIF 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST , Slide, row spacing 6.15 mm (242 mils), body size 10.8x16.8mm 6x-dip-switch SPST KingTek_DSHP06TS, Slide, row spacing.

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