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Http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.5mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Stretched Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12855&prodName=TLP290-4), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 2, Wuerth electronics 9775036960 (https://katalog.we-online.com/em/datasheet/9775036960.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.1 mm² wires, reinforced insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfn/05081595_0_lqfn16.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, B13B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST SHL series connector, 502494-0870 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770190-x, 5 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2391, 23 Circuits (https://www.molex.com/pdm_docs/sd/2005280230_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 4 pins, pitch 7.5mm, size 45x11mm^2, drill diamater 1.1mm, pad diameter.

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