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734-164 , 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate top entry Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FF0825SA1, 25 Circuits (https://www.molex.com/pdm_docs/sd/2005280250_sd.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-F (6032-20 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-P (2012-15 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20035/dcrcwe3.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 44 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-4 Vertical RM 5.45mm TO-264-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST , Slide, row spacing 6.15 mm (242 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 6x-dip-switch SPST Copal_CHS-06A, Slide, row spacing 10.16 mm (400 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62.

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