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Instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 900.

• .../PCB/precadsr_Gerbers/precadsr-F_Paste.gbr | 15 .../precadsr-panel-SilkBottom.gbo .
• 30W POE, Silvertel, pitch.
• 4.452703e-003 -0.000000e+000 vertex 5.649070e+000 4.246676e+000 9.983999e+000 vertex.
• -8.947822e-02 3.134218e-04 9.959887e-01 facet normal.

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