Labels Milestones
BackMils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP.
- 0.195255 -2.81323e-07 vertex 3.42107.
- Package SOT 963 6 pins package 1x0.8mm.
- Pitch 3.81mm, size 7.51x7.3mm^2.
- Vertex 2.64292 -8.55797 3.82299 vertex 8.83147 -1.71116.