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Removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 2mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081669_A_MS16.pdf), generated.

0.111558 0.258184 0.959633 facet.
10.1+center_adjust; //mm second_col = width_mm/2; //mm third_col.
1.19444 5.69312 21.335 facet normal 0.900365 0.42367.
205-00296 pitch 5.08mm size 45.7x10.6mm^2.

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