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BackH=4.5mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf inductor sagami cer12xxb smd Inductor, Wuerth Elektronik, Wuerth_MAPI-2508, 2.5mmx2.0mm Inductor, Wuerth Elektronik, Wuerth_HCM-1070, 10.1mmx7.0mm Inductor, Wuerth Elektronik, WE-PD4, SMT, Typ X, https://katalog.we-online.de/pbs/datasheet/74458001.pdf Choke Power Inductor Ms50T SMD Fixed inductor Neosid, Power Inductor, SM-PIC0602H, Fixed inductor, high temperature, https://neosid.de/import-data/product-pdf/neoFestind_Ms50T.pdf Neosid Power Inductor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator JST XA series connector, B2P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0411-3-51, 11 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex PicoBlade series connector, S13B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 top entry Molex PicoBlade series connector, B14B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 48 Pin (https://www.nxp.com/docs/en/package-information/98ASA00694D.pdf DFN8 2x2, 0.5P; No exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin without exposed pad 8-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SM) - 5.28 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST , Piano, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile.
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