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BackPlastic Quad Flat, No Lead Package - 3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, size 15.7x6.2mm^2, drill diamater 1.2mm, pad diameter 2mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST EH series connector, S28B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-R (7260-38 Metric.
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