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Pad SMD pad as test Point, square 2.0mm side length test point SMD pad SMD pad as test Point, square 2.5mm side length SMD rectangular pad as test Point, square 3.0mm side length, hole diameter 1.3mm, length 10.0mm, width 3.5mm, e.g. Ettinger 13.13.865, https://katalog.ettinger.de/#p=434 solder Pin_ diameter 1.0mm, hole diameter 1.3mm, hole diameter 1.0mm wire loop with bead as test point, loop diameter2.6mm, hole diameter 1.0mm wire loop with bead as test Point, diameter 4.0mm Plated Hole as test Point, diameter 3.0mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-169XCGDK(Ver.9B).pdf LED_Rectangular Rectangular Rectangular size 4.8x2.5mm^2 diameter 2.0mm test point plated hole Plated Hole as test point, loop diameter2.548mm, hole diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DA), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 (so is open or ground). Part of \nloop mod Part of \nloop mod Part of \nloop mod Part of \nloop mod Part of speed \nswitch mod (0 F.Cu signal (31 "B.Cu" signal (32 "B.Adhes" user "B.Adhesive" (33 "F.Adhes" user "F.Adhesive" 36 "B.SilkS" user "B.Silkscreen" (37 "F.SilkS" user "F.Silkscreen" 40 "Dwgs.User" user "User.Drawings" 41 "Cmts.User" user "User.Comments" 42.

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