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5.30329 -5.30329 6.0001 vertex -6.23601 -4.16677 6.0001 vertex 2.87011 -6.92909 6.0001 vertex 2.87012 -6.92909 6.0001 vertex 2.87012 -6.92909 6.0001 vertex -1.46317 -7.35588 6.0001 vertex 2.87012 -6.92909 6.0001 vertex -6.23601 4.16677 6.0001 vertex 2.87013 -6.92908 6.0001 vertex 2.87013 6.92908 6.0001 vertex 7.35588 -1.46317 6.0001 vertex 4.16677 6.23601 6.0001 vertex -6.23601 -4.16677 6.0001 vertex -6.23601 -4.16678 6.0001 vertex 4.16677 -6.23601 6.0001 vertex -6.92909 2.87011 6.0001 vertex -6.92909 2.87011 6.0001 vertex -6.23601 -4.16677 6.0001 vertex 6.92909 2.87012 6.0001 vertex 2.87012 6.92909 6.0001 vertex 2.87011 -6.92909 6.0001 vertex -5.30329 5.30329 6.0001 vertex 6.23601 4.16677 6.0001 vertex 0 -7.79364 5.97318 facet normal 0.0950838 -0.0293292 -0.995037 vertex 9.90388 -1.32255 0.0400096 facet normal -0.904824 -0.425785 0 Latest commits for file .gitattributes | 2 Smaller cap (476nF?) for C1 Ceramic 104s for C10, C14, might be fine, might introduce intermittents - Don't put R8 so close to R26 - D36/R47 too close Testing before powering up: Clock In - diode to U2-3 - Clock rate (B100k) (not sure yet which 2 pins diameter 5.0mm z-position of LED center 6.0mm 2 pins LED diameter 3.0mm z-position of LED center 3.0mm, 2 pins, diameter 3.0mm z-position of LED center 1.6mm 2 pins diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 2.0mm, 2 pins, pitch 3.5mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.15 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, S13B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VLGA, 4 Pin (https://sensirion.com/media/documents/33FD6951/624C4357/Datasheet_SHT4x.pdf LGA, 16 Pin (https://ams.com/documents/20143/36005/AS5055A_DS000304_2-00.pdf#page=24), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.15 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, DF52-15S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF (T2044-2)), generated with kicad-footprint-generator JST PH series connector, DF3EA-15P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 3, Wuerth electronics 9774150960 (https://katalog.we-online.de/em/datasheet/9774150960.pdf,), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (http://www.ti.com/lit/ds/symlink/tlc5957.pdf#page=23), generated with kicad-footprint-generator connector Molex Pico-EZmate_Slim side entry JST EH series connector, B34B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package.

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