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WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 4.466x4.395mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 501920-5001, 50 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTBA_2,5/9-G-5,08; number of pins: 08; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1766327 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/4-GF-5.08; number of steps (sw11 // for spherical indentations, set the quantity, quality, radius, height, and placement cylinder_starting_rotation = -33.3; // these two pots In normal position, loop is disconnected from trigger,\nnormalization is removed from gate jack, and\nsustain pot level is used. C1 is too small for film; is film needed? - Smaller cap (476nF?) for C1 Ceramic 104s for C10, C14, might be more robust and easier to adjust CV output range, switch between 5v and 2.5v max (or whatever is configured). - Momentary-normal-off pushbutton to manually reset.

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